AUREL SpA, based in Modigliana (FC), was founded in 1970 and has established a relevant market position in the advanced electronic sector. Main activity is to develop and manufacture electronic circuits and equipment suitable for Thick Film technology production process. Aurel is also able to design and manufacture test and qualification set ups to be used in line with production equipments to assure full testing in real time of great numbers of circuits, with automatic flow and handling, optimized to mark out via laser even every single failing unit. A group of specialists is dedicated to each area of development and can offer support to already established hybrid circuits/SMD Customers and to new users of technologies, with assurance of a complete customized design service.
MAIN TASKS IN THE PROJECT
Main activity related to the project refers to the improvement of the thermal behavior of the receiver, in order to lower the cell’s working temperature, which both increases the conversion efficiency and the reliability, the improvement of the sealing process, the improvement of the SOEattach method.
RELEVANT EXPERIENCE AND PUBLICATIONS/PATENTS
Close collaboration with main research and development centers active in scientific activities was essential to AUREL. Examples are the joint collaboration with Cern in Geneve, with realization of supports suitable to work in liquid helium environment as particle sensors. Today INFN (Istituto Nazionale di Fisica Nucleare) is using Aurel technology services to realize complex supports to be used in research areas. In 2005 a joint Collaboration with ENEA in Portici (Na) to realize concentration solar cells. Supports are made of aluminum nitride to have high heat dissipation in small spaces and new screen printing/ gluing technologies are studied to handle the concentration cell with dimensions even smaller than a square centimeter. In 2008 Development and production of low cost en-lamed steel supports, available also in great numbers to be used in heating elements for civil applications. Also in 2008 Deposition of insulation elements on LED heat dissipation, with no need to interpose further insulation elements. Joint ventures to make available lighting units with innovative characteristics and with evident lighting efficiency in respect to relevant energy savings.